XRT86VX38IB329-F
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 329-FBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.3V |
| Function | Line Interface Unit (LIU) |
| Number of Circuits | 8 |
XRT86VX38IB329-F Overview
The 329-FBGA package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.Mounting type Surface Mount is used.An 8-circuit makes up this telecom IC .The voltage supplied to 3.3V can improve efficiency.A temperature setting of -40°C~85°C ensures reliable performance.
XRT86VX38IB329-F Features
Available in the 329-FBGA package
XRT86VX38IB329-F Applications
There are a lot of MaxLinear, Inc. XRT86VX38IB329-F Telecom applications.
- E3/DS3 Access Equipment
- Private branch exchange (PBX)
- Integrated Multi-Service Access Platforms (IMAPs)
- ISDN terminal adapter
- ISDN Primary Rate Interfaces (PRA)
- E1 Rates PCM Line Interface
- SDH/SONET multiplexers
- Integrated Access Devices
- Fiber In The Loop (FITL)
- E1 Multiplexer