XR2A-4001-N

XR2A-4001-N

CONN IC DIP SOCKET 40POS GOLD


Details

Tags

Parameters
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Number of Positions or Pins (Grid) 40 (2 x 20)
Contact Material - Mating Beryllium Copper
Contact Material - Post Beryllium Copper
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2002
Series XR2
JESD-609 Code e4
Feature Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Type DIP, 0.6 (15.24mm) Row Spacing
Number of Rows 2
Contact Finish - Mating Gold
Orientation Straight
Pitch - Mating 0.100 2.54mm
Number of Contacts 40
Contact Resistance 20mOhm
Max Voltage Rating (AC) 300V
Max Current Rating 1A
Termination Post Length 0.126 3.20mm
Pitch - Post 0.100 2.54mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Contact Finish Thickness - Post 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status RoHS Compliant
See Relate Datesheet

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