XCZU4CG-2SFVC784I

XCZU4CG-2SFVC784I

784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.85V


  • Manufacturer: Xilinx Inc.
  • Origchip NO: 903-XCZU4CG-2SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 594
  • Description: 784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.85V (Kg)

Details

Tags

Parameters
Factory Lead Time 11 Weeks
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC CG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.85V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 252
Speed 533MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).


A core processor Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? is used to build this SoC.Assigned with the package 784-BFBGA, FCBGA, this system on a chip comes from the manufacturer.A 256KB RAM SoC chip provides reliable performance to users.This SoC design employs the MCU, FPGA technique for its internal architecture.Zynq? UltraScale+? MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.Taking note of the fact that this SoC security combines Zynq?UltraScale+? FPGA, 192K+ Logic Cells is important.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.A 0.85V power supply should be used.In total, there are 784 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.

Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XCZU4CG-2SFVC784I System On Chip (SoC) applications.

  • Optical drive
  • Automated sorting equipment
  • Avionics
  • sequence controllers
  • Smartphones
  • Efficient hardware for inference of neural networks
  • Medical
  • Cyber security for critical applications in the aerospace
  • Central inverter
  • Sports

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