XC7Z035-2FFG676I
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Zynq®-7000 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 800MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Max Supply Voltage | 1.05V |
| Min Supply Voltage | 950mV |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Propagation Delay | 100 ps |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | 2 |
| Primary Attributes | Kintex™-7 FPGA, 275K Logic Cells |
| Number of Registers | 343800 |
| Height Seated (Max) | 3.37mm |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
There are Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processors in this SoC.Manufacturer assigns package 676-BBGA, FCBGA to this system on a chip.With 256KB RAM implemented, this SoC chip provides users with reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Zynq?-7000 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 275K Logic Cells.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 130 I/Os.For safe operation, it is advisable to utilize a power supply with 1V voltage.In total, there are 676 terminations, which is great for system on a chip.In this wireless SoC, the frequency is set to 800MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.Moreover, this SoC processor also includes PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY as its additional features.There is a maximum supply voltage of 1.05V.It is supplied with at least 950mV power.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
There are a lot of Xilinx Inc.
XC7Z035-2FFG676I System On Chip (SoC) applications.
- Industrial transport
- Cyberphysical system-on-chip
- ARM Cortex M4 microcontroller
- Smartphones
- Vending machines
- Digital Media
- Keyboard
- Digital Signal Processing
- Keywords
- Mobile market