VSC8541XMV-03
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Mounting Type | Surface Mount |
| Supplier Device Package | 68-QFN (8x8) |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2009 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8541XMV-03 Overview
In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits make up this telecom IC .Using -40°C~125°C as the operating temperature can result in reliable performance.
VSC8541XMV-03 Features
VSC8541XMV-03 Applications
There are a lot of Microchip Technology VSC8541XMV-03 Telecom applications.
- Residential Gateways
- CSU/DSU E1 Interface
- DECT (Digital European Cordless Telephone) Base Stations
- T1/E1/J1 LAN/WAN Routers
- PDH Multiplexers
- Central office (CO)
- Switching Systems
- DECT (Digital European Cordless Telephone) Base
- Fault Tolerant Systems
- Home Side Box