VSC8504XKS-02
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V |
| Function | Ethernet |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8504XKS-02 Overview
Space is saved on the board by using the 256-BGA package.For packing, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits are used in this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 1V can be operated more efficiently.
VSC8504XKS-02 Features
Available in the 256-BGA package
VSC8504XKS-02 Applications
There are a lot of Microchip Technology VSC8504XKS-02 Telecom applications.
- Digital subscriber line access multiplexer (DSLAM)
- M13 MUX
- Digital Cross-connect Systems (DCS)
- PCM channel bank
- Set-Top Box
- ISDN NT1/TA
- DECT (Digital European Cordless Telephone) Base
- SONET/SDH terminal
- Cable modem
- E1 Rates PCM Line Interface