VSC8258YMR-01
| Parameters | |
|---|---|
| Factory Lead Time | 5 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 256-BBGA, FCBGA |
| Supplier Device Package | 256-FCBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 970mV 1.2V |
| Function | Ethernet |
| Interface | SPI |
| Number of Circuits | 4 |
| RoHS Status | ROHS3 Compliant |
VSC8258YMR-01 Overview
To save board space, the 256-BBGA, FCBGA package is used.To pack telecommunications equipment, the way of Tray is used.Mounting type Surface Mount is used.An 4-circuit makes up this telecom IC .Providing 970mV 1.2V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.
VSC8258YMR-01 Features
Available in the 256-BBGA, FCBGA package
VSC8258YMR-01 Applications
There are a lot of Microchip Technology VSC8258YMR-01 Telecom applications.
- Inverse Multiplexing for ATM (IMA)
- Fiber Optic Terminals
- T1/E1/J1 Multiplexer and Channel Banks
- CSU/DSU E1 Interface
- E1 Rates PCM Line Interface
- Home Gateway
- Channel Banks
- Switching Systems
- PBX (Private Branch Exchange)
- Hybrid fiber coax (HFC)