VSC7424XJG-02
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | 672-BGA |
| Supplier Device Package | 672-HSBGA (27x27) |
| Packaging | Tray |
| Series | SparX™-III-10 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V |
| Function | Ethernet Switch |
| Interface | Serial |
| Number of Circuits | 1 |
| Data Rate | 1 Gbps |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC7424XJG-02 Overview
A 672-BGA package saves space on a board.For telecommunications equipment packing, the Tray method is used.In this case, Surface Mount is the mounting type.Telecommunications equipment consists of 1 circuits.Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.This part can perform many functions similar to the electronic parts under the SparX?-III-10 series.
VSC7424XJG-02 Features
Available in the 672-BGA package
VSC7424XJG-02 Applications
There are a lot of Microchip Technology VSC7424XJG-02 Telecom applications.
- DECT (Digital European Cordless Telephone) Base
- Multi-Line E1 Interface Cards
- Fiber Optic Terminals
- CSU/DSU E1 Interface
- Central office
- Routers
- Wireless local loop (WLL)
- Fiber
- E3/DS3 Access Equipment
- Multiplexers