VSC7421XJQ-02
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Lifecycle Status | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | TQFP |
| Supplier Device Package | 302-TQFP (24x24) |
| Packaging | Tray |
| Series | SparX™-III-17um |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | 0°C |
| Voltage - Supply | 1V |
| Function | Ethernet Switch |
| Interface | Serial |
| Number of Circuits | 1 |
| Data Rate | 1 Gbps |
| RoHS Status | ROHS3 Compliant |
VSC7421XJQ-02 Overview
TQFP package is used to save board space.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.This telecom IC is composed of 1 circuits.1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The SparX?-III-17um series is capable of providing a number of similar functions to the W series.Normal operation is ensured by setting 0°C to a minimum value.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.
VSC7421XJQ-02 Features
Available in the TQFP package
VSC7421XJQ-02 Applications
There are a lot of Microchip Technology VSC7421XJQ-02 Telecom applications.
- ISDN terminal adapter
- T1 Digital Cross Connects (DSX-1)
- Short/Medium Loop
- PCM Test Equipment
- CSU/DSU E1/T1/J1 Interface
- Interfaces to E3
- Fiber in the loop (FITL)
- T1/E1/J1 Performance Monitoring
- High speed data transmission line cards
- Integrated Multi-Service Access Platforms (IMAPs)