| Parameters |
| Package / Case |
SOIC |
| Surface Mount |
YES |
| Pbfree Code |
no |
| Number of Terminations |
28 |
| ECCN Code |
EAR99 |
| HTS Code |
8542.39.00.01 |
| Subcategory |
Power Management Circuits |
| Technology |
BICMOS |
| Terminal Position |
DUAL |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
| Number of Functions |
1 |
| Supply Voltage |
5V |
| Terminal Pitch |
1.27mm |
| Reach Compliance Code |
not_compliant |
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
| Pin Count |
28 |
| JESD-30 Code |
R-PDSO-G28 |
| Qualification Status |
Not Qualified |
| Operating Temperature (Max) |
70°C |
| Supply Voltage-Max (Vsup) |
9V |
| Power Supplies |
4.5/8.0V |
| Temperature Grade |
COMMERCIAL |
| Supply Voltage-Min (Vsup) |
4.5V |
| Number of Channels |
5 |
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT |
| Adjustable Threshold |
NO |
| Height Seated (Max) |
2.64mm |
| Length |
17.905mm |
| Width |
7.5mm |
| RoHS Status |
Non-RoHS Compliant |
| Lead Free |
Contains Lead |
UCC3831DWP Overview
There is a SOIC package that includes this.At present, 5 channels are available.There are a total of 28 terminations on it.Device DUAL is located at the terminal position.There are a total of 28 pins on it.Hot-swappable device is possible to achieve high efficiency wHot-swappable deviceh a supply voltage of 5V.As far as Power Management Circuits is concerned, this gadget is self-contained.For normal operation, Vsup should be kept above 4.5V.9V (maximum supply voltage) is set.Part 4.5/8.0V is associated with power supplies.Hot Swap uses an analog IC, in this case a POWER SUPPLY SUPPORT CIRCUIT.
UCC3831DWP Features
The terminal position of 28
UCC3831DWP Applications
There are a lot of Texas Instruments UCC3831DWP hot swap controllers applications.
- Other forms of communications infrastructure
- Telecom server
- Reverse current protection
- Electric vehicle
- Circuit breakers for electronic circuits
- ISDN system
- High power circuit board
- Redundant Array of Disks (RAID)
- Thermal limitation
- Storage network