TS391SNL250
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Shelf Life | 12 Months |
| Storage/Refrigeration Temperature | 68°F~77°F 20°C~25°C |
| Shelf Life Start | Date of Manufacture |
| Form | Jar, 8.8 oz (250g) |
| Process | Lead Free |
| Melting Point | 423°F~428°F 217°C~220°C |
| Flux Type | No-Clean |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet