| Parameters |
| Mount |
Surface Mount |
| Package / Case |
BGA |
| Number of Pins |
376 |
| Max Operating Temperature |
125°C |
| Min Operating Temperature |
-40°C |
| Frequency |
300MHz |
| Interface |
Ethernet, I2C, McASP, UART |
| Max Supply Voltage |
3.63V |
| Min Supply Voltage |
1.14V |
| RAM Size |
64kB |
| Frequency (Max) |
300MHz |
| Data Bus Width |
16b |
| RoHS Status |
RoHS Compliant |
TMS320DM6431ZDUQ3 Overview
The BGA package contains these electronic components.Its configuration includes 376 pins.300MHz is a frequency at which the device operates according to a specific design.Using Surface Mount as a mounting method, it is mounted.This device requires a minimum voltage of 1.14V.It is capable of receiving a maximum voltage of 3.63V.A lower operating temperature than 125°C is recommended.Temperatures should exceed -40°C during operation.The maximum value of its frequency should be kept below 300MHz.
TMS320DM6431ZDUQ3 Features
Supplied in the BGA package
TMS320DM6431ZDUQ3 Applications
There are a lot of Texas Instruments TMS320DM6431ZDUQ3 DSP applications.
- Infrared
- Smart phones
- Machinery and equipment
- Audio compression
- Geoscience signal processing
- Audio signal
- Digital image processing, data compression
- Image signal processing
- Infinite impulse response filters
- TVs