| Parameters | |
|---|---|
| Shape | Rectangular |
| Packaging | Tape & Reel (TR) |
| Published | 2012 |
| Series | SiSonic™ SP |
| Size / Dimension | 0.132Lx0.098W 3.35mmx2.50mm |
| JESD-609 Code | e4 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 3 |
| Termination | Solder Pads |
| Type | MEMS (Silicon) |
| Terminal Finish | GOLD OVER NICKEL |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Voltage - Rated | 3.6V |
| HTS Code | 8542.39.00.01 |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Number of Functions | 1 |
| Depth | 1.08mm |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XBCC-X3 |
| Output Type | Analog |
| Operating Supply Voltage | 3.6V |
| Supply Voltage-Min (Vsup) | 1.5V |
| Operating Supply Current | 160μA |
| Impedance | 400Ohm |
| Direction | Omnidirectional |
| Voltage Range | 1.5V~3.6V |
| Frequency Range | 100Hz~15kHz |
| Signal to Noise Ratio (SNR) | 63 dB |
| Sensitivity | -38dB ±3dB @ 94dB SPL |
| Port Location | Bottom |
| Height | 1.08mm |
| Length | 3.35mm |
| Width | 2.5mm |
| RoHS Status | RoHS Compliant |