| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks | 
| Published | 2013 | 
| Series | SMD2 | 
| Part Status | Active | 
| Moisture Sensitivity Level (MSL) | Not Applicable | 
| Type | Solder Sphere | 
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 
| Shelf Life | 24 Months | 
| Shelf Life Start | Date of Manufacture | 
| Form | Jar | 
| Process | Lead Free | 
| Melting Point | 423°F~428°F 217°C~220°C | 
| Diameter | 0.024 0.61mm | 
| RoHS Status | ROHS3 Compliant |