SI32266-C-GM1
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 50-QFN (6x8) |
| Packaging | Tray |
| Published | 2014 |
| Series | ProSLIC® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Function | Subscriber Line Interface Concept (SLIC), CODEC |
| Interface | GCI, PCM, SPI |
| Number of Circuits | 1 |
| Telecom IC Type | DIGITAL SLIC |
| RoHS Status | RoHS Compliant |
SI32266-C-GM1 Overview
A QFN package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A Surface Mount-axis mounts telecom switching.DIGITAL SLIC is the type of IC it uses for telecom.This part can perform many functions similar to the electronic parts under the ProSLIC? series.
SI32266-C-GM1 Features
Available in the QFN package
DIGITAL SLIC as telecom IC type
SI32266-C-GM1 Applications
There are a lot of Silicon Labs SI32266-C-GM1 Telecom applications.
- T1/E1/J1 Multiplexer and Channel Banks
- Multi-Line E1 Interface Cards
- Codec function on telephone switch line cards
- ATM Switches
- Channel Service Units (CSUs): T1/E1/J1
- Integrated Multi-Service Access Platforms (IMAPs)
- Digital cross connects (DSX-1)
- Stations
- DECT (Digital European Cordless Telephone) Base
- E1 Multiplexer