Parameters | |
---|---|
Contact Plating | Tin |
Mount | Surface Mount |
Package / Case | QFN EP |
Number of Pins | 16 |
Published | 2005 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 |
Number of Terminations | 16 |
Max Operating Temperature | 85°C |
Min Operating Temperature | -40°C |
HTS Code | 8542.39.00.01 |
Terminal Position | QUAD |
Peak Reflow Temperature (Cel) | 260 |
Number of Functions | 1 |
Supply Voltage | 1.8V |
Terminal Pitch | 0.5mm |
Frequency | 300MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Pin Count | 16 |
Operating Supply Voltage | 1.8V |
Temperature Grade | INDUSTRIAL |
Max Supply Voltage | 1.9V |
Min Supply Voltage | 1.7V |
Telecom IC Type | TELECOM CIRCUIT |
Height | 950μm |
Length | 3mm |
Width | 3mm |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |