| Parameters | |
|---|---|
| Package / Case | TFBGA |
| Surface Mount | YES |
| Number of Pins | 64 |
| JESD-609 Code | e1 |
| Moisture Sensitivity Level (MSL) | 1 |
| Number of Terminations | 64 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -30°C |
| HTS Code | 8542.39.00.01 |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.65mm |
| Frequency | 13.56MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Temperature Grade | OTHER |
| Interface | SPI, UART |
| Telecom IC Type | TELECOM CIRCUIT |
| Height Seated (Max) | 1.15mm |
| Length | 5.5mm |
| Width | 5.5mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |