PM5326H-FI
| Parameters | |
|---|---|
| Factory Lead Time | 20 Weeks |
| Mounting Type | Surface Mount |
| Supplier Device Package | 1292-FCBGA |
| Packaging | Tray |
| Published | 1997 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 1.2V |
| Function | SONET/SDH |
| Interface | SFI-4 |
| RoHS Status | Non-RoHS Compliant |
PM5326H-FI Overview
A Tray-packing method is used to pack telecommunications equipment.The mounting type of this telecom circuit is Surface Mount.Improved efficiency can be ensured when the supply voltage of 1.2V is provided.
PM5326H-FI Features
PM5326H-FI Applications
There are a lot of Microchip Technology PM5326H-FI Telecom applications.
- Channel Banks
- High speed data transmission line cards
- Digital Cross-connect Systems (DCS)
- Voice over IP/DSL
- DECT (Digital European Cordless Telephone) Base Stations
- Set-Top Box
- T1/E1/J1 Performance Monitoring
- ISDN Primary Rate Interface
- Frame Relay Switches and Access Devices (FRADS)
- Integrated Access Devices