PCX755BVZFU350LE
| Parameters | |
|---|---|
| Package / Case | 360-BBGA Exposed Pad |
| Supplier Device Package | 360-PBGA (25x25) |
| Operating Temperature | -40°C~110°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | PCX755 |
| Speed | 350MHz |
| Core Processor | PowerPC |
| Voltage - I/O | 2.5V 3.3V |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RoHS Status | Non-RoHS Compliant |
PCX755BVZFU350LE Overview
The embedded microprocessor ships overseas conveniently packed in 360-BBGA Exposed Pad. In order to provide high reliability, advanced packaging method Tray is used. Cores/Bus width is 1 Core 32-Bit. K-40°C~110°C TJw what the operating temperature is around -40°C~110°C TJ. The CPU is powered by a PowerPC core. As far as I/O is concerned, this CPU runs at 2.5V 3.3V. PCX755 is a good way to search for variants of the microprocessor. Suppliers are offering 360-PBGA (25x25) packages.
PCX755BVZFU350LE Features
PowerPC Core
PCX755BVZFU350LE Applications
There are a lot of Microchip Technology PCX755BVZFU350LE Microprocessor applications.
- Removable disks
- Firewalls
- Fire detection & safety devices
- Smartphones-calling, video calling, texting, email
- Mobile computers
- Measurement and control field
- Smoke alarms
- DVD\DV\MP3 players
- Set-top boxes
- Microwave ovens