PCX755BVZFU300LE
| Parameters | |
|---|---|
| Package / Case | 360-BBGA Exposed Pad |
| Supplier Device Package | 360-PBGA (25x25) |
| Operating Temperature | -40°C~110°C TJ |
| Packaging | Tray |
| Published | 2006 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | PCX755 |
| Speed | 300MHz |
| Core Processor | PowerPC |
| Voltage - I/O | 2.5V 3.3V |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | No |
| RoHS Status | Non-RoHS Compliant |
PCX755BVZFU300LE Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 360-BBGA Exposed Pad. High reliability is achieved with advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. The operating temperature around -40°C~110°C TJ should be understood. A PowerPC processor is present in this CPU. I/O is run at 2.5V 3.3V on this CPU. You can search for variants of a microprocessor with PCX755. 360-PBGA (25x25) package is offered by suppliers.
PCX755BVZFU300LE Features
PowerPC Core
PCX755BVZFU300LE Applications
There are a lot of Microchip Technology PCX755BVZFU300LE Microprocessor applications.
- Projector
- Leakage current tester
- Temperature sensing and controlling devices
- Printers
- Firewalls
- Oscilloscopes
- Smart highways (navigation, traffic control, information monitoring and car service)
- Toys
- Industrial control field
- Heater/Fan