| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            12 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            624-FBGA, FCBGA | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            -40°C~125°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tape & Reel (TR) | 
                                        
                                                                            
                                            | Published | 
                                            2002 | 
                                        
                                                                            
                                            | Series | 
                                            i.MX6Q | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            3 (168 Hours) | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            260 | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            40 | 
                                        
                                                                            
                                            | Speed | 
                                            1.0GHz | 
                                        
                                                                            
                                            | Core Processor | 
                                            ARM® Cortex®-A9 | 
                                        
                                                                            
                                            | Voltage - I/O | 
                                            1.8V 2.5V 2.8V 3.3V | 
                                        
                                                                            
                                            | Ethernet | 
                                            10/100/1000Mbps (1) | 
                                        
                                                                            
                                            | Number of Cores/Bus Width | 
                                            4 Core 32-Bit | 
                                        
                                                                            
                                            | Graphics Acceleration | 
                                            Yes | 
                                        
                                                                            
                                            | RAM Controllers | 
                                            LPDDR2, LVDDR3, DDR3 | 
                                        
                                                                            
                                            | USB | 
                                            USB 2.0 + PHY (4) | 
                                        
                                                                            
                                            | Additional Interfaces | 
                                            CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART | 
                                        
                                                                            
                                            | Co-Processors/DSP | 
                                            Multimedia; NEON™ SIMD | 
                                        
                                                                            
                                            | Security Features | 
                                            ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 
                                        
                                                                            
                                            | Display & Interface Controllers | 
                                            Keypad, LCD | 
                                        
                                                                            
                                            | SATA | 
                                            SATA 3Gbps (1) | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                MCIMX6Q6AVT10AER Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 624-FBGA, FCBGA. A high level of reliability is provided by using an advanced packaging method Tape & Reel (TR). Cores/Bus width of the CPU is 4 Core 32-Bit . Understand how the operating temperature around -40°C~125°C TJ is determined. In the i.MX6Q series, it is found. The CPU is cored with a ARM? Cortex?-A9 processor. There are LPDDR2, LVDDR3, DDR3 RAM controllers used by this CPU. This microprocessor has CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART interfaces to serve you better. There is 1.8V 2.5V 2.8V 3.3V I/O running on this CPU. 
MCIMX6Q6AVT10AER Features
ARM? Cortex?-A9 Core
MCIMX6Q6AVT10AER Applications
There are a lot of NXP USA Inc. MCIMX6Q6AVT10AER Microprocessor applications. 
- DDC control
 - Food and beverage
 - Routers
 - Sonography (Ultrasound imaging)
 - Home video and audio
 - Industrial robot
 - Paper shredders
 - Vacuum cleaners
 - Calculators
 - Virtual reality VR robots