MCIMX6Q5EYM10ADR
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 624-LFBGA, FCBGA |
| Operating Temperature | -20°C~105°C TJ |
| Packaging | Tape & Reel (TR) |
| Published | 2002 |
| Series | i.MX6Q |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.8V 2.5V 2.8V 3.3V |
| Ethernet | 10/100/1000Mbps (1) |
| Number of Cores/Bus Width | 4 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (4) |
| Additional Interfaces | CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| SATA | SATA 3Gbps (1) |
| RoHS Status | ROHS3 Compliant |
MCIMX6Q5EYM10ADR Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 624-LFBGA, FCBGA. High reliability is achieved using advanced packaging method Tape & Reel (TR). A CPU with 4 Core 32-Bit cores and width 4 Core 32-Bit busses is used. Identify the operating temperature around -20°C~105°C TJ. In the series i.MX6Q, it is found. This CPU is cored with a ARM? Cortex?-A9 processor. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. The microprocessor features interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART for better service. The CPU runs I/O at 1.8V 2.5V 2.8V 3.3V.
MCIMX6Q5EYM10ADR Features
ARM? Cortex?-A9 Core
MCIMX6Q5EYM10ADR Applications
There are a lot of NXP USA Inc. MCIMX6Q5EYM10ADR Microprocessor applications.
- 3D printers
- Industrial instrumentation devices
- Scanners
- Teletext terminals
- Set-top boxes
- Safety -airbags, automatic braking system (ABS)
- Robots
- Day to day life field
- Copiers
- Instrumentation and process control field