| Parameters | 
                                
                                                                                                            
                                            | Factory Lead Time | 
                                            12 Weeks | 
                                        
                                                                            
                                            | Package / Case | 
                                            432-TFBGA | 
                                        
                                                                            
                                            | Surface Mount | 
                                            YES | 
                                        
                                                                            
                                            | Operating Temperature | 
                                            0°C~95°C TJ | 
                                        
                                                                            
                                            | Packaging | 
                                            Tray | 
                                        
                                                                            
                                            | Series | 
                                            i.MX6SL | 
                                        
                                                                            
                                            | Part Status | 
                                            Active | 
                                        
                                                                            
                                            | Moisture Sensitivity Level (MSL) | 
                                            3 (168 Hours) | 
                                        
                                                                            
                                            | HTS Code | 
                                            8542.31.00.01 | 
                                        
                                                                            
                                            | Technology | 
                                            CMOS | 
                                        
                                                                            
                                            | Terminal Position | 
                                            BOTTOM | 
                                        
                                                                            
                                            | Terminal Form | 
                                            BALL | 
                                        
                                                                            
                                            | Peak Reflow Temperature (Cel) | 
                                            260 | 
                                        
                                                                            
                                            | Terminal Pitch | 
                                            0.5mm | 
                                        
                                                                            
                                            | Time@Peak Reflow Temperature-Max (s) | 
                                            40 | 
                                        
                                                                            
                                            | JESD-30 Code | 
                                            S-PBGA-B | 
                                        
                                                                            
                                            | Supply Voltage-Max (Vsup) | 
                                            1.5V | 
                                        
                                                                            
                                            | Supply Voltage-Min (Vsup) | 
                                            1.375V | 
                                        
                                                                            
                                            | Speed | 
                                            1.0GHz | 
                                        
                                                                            
                                            | uPs/uCs/Peripheral ICs Type | 
                                            MICROPROCESSOR, RISC | 
                                        
                                                                            
                                            | Core Processor | 
                                            ARM® Cortex®-A9 | 
                                        
                                                                            
                                            | Voltage - I/O | 
                                            1.2V 1.8V 3.0V | 
                                        
                                                                            
                                            | Ethernet | 
                                            10/100Mbps (1) | 
                                        
                                                                            
                                            | Number of Cores/Bus Width | 
                                            1 Core 32-Bit | 
                                        
                                                                            
                                            | Graphics Acceleration | 
                                            Yes | 
                                        
                                                                            
                                            | RAM Controllers | 
                                            LPDDR2, LVDDR3, DDR3 | 
                                        
                                                                            
                                            | USB | 
                                            USB 2.0 + PHY (3) | 
                                        
                                                                            
                                            | Additional Interfaces | 
                                            AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART | 
                                        
                                                                            
                                            | Co-Processors/DSP | 
                                            Multimedia; NEON™ SIMD | 
                                        
                                                                            
                                            | Security Features | 
                                            ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 
                                        
                                                                            
                                            | Display & Interface Controllers | 
                                            Keypad, LCD | 
                                        
                                                                            
                                            | Height Seated (Max) | 
                                            1.1mm | 
                                        
                                                                            
                                            | Length | 
                                            13mm | 
                                        
                                                                            
                                            | RoHS Status | 
                                            ROHS3 Compliant | 
                                        
                                                                                                    
                            
                         
                                                MCIMX6L8DVN10AC Overview
With a packing size of 432-TFBGA, this embedded microprocessor is ideal for international shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand the operating temperature around 0°C~95°C TJ. This is part of the i.MX6SL series. A ARM? Cortex?-A9 processor is present in this CPU. The CPU contains LPDDR2, LVDDR3, DDR3 RAM controllers. The microprocessor features interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART for better service. I/O is run at 1.2V 1.8V 3.0V on this CPU. uPs/uCs/Peripheral ICs type is MICROPROCESSOR, RISC. With a maximum supply current of 1.5V, it has a maximum power consumption. 
MCIMX6L8DVN10AC Features
ARM? Cortex?-A9 Core
MCIMX6L8DVN10AC Applications
There are a lot of NXP USA Inc. MCIMX6L8DVN10AC Microprocessor applications. 
- Electromechanical control
 - Microwave ovens
 - Entertainment products
 - Hearing aids
 - Agriculture, transportation field
 - Dryers
 - Pacemakers (used to control abnormal heart rhythm)
 - Blenders
 - Safety field
 - Television