MCIMX6L2EVN10ACR
| Parameters | |
|---|---|
| Factory Lead Time | 15 Weeks |
| Package / Case | 432-TFBGA |
| Operating Temperature | -40°C~105°C TA |
| Packaging | Tape & Reel (TR) |
| Series | i.MX6SL |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Speed | 1.0GHz |
| Core Processor | ARM® Cortex®-A9 |
| Voltage - I/O | 1.2V 1.8V 3.0V |
| Ethernet | 10/100Mbps (1) |
| Number of Cores/Bus Width | 1 Core 32-Bit |
| Graphics Acceleration | Yes |
| RAM Controllers | LPDDR2, LVDDR3, DDR3 |
| USB | USB 2.0 + PHY (3) |
| Additional Interfaces | AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
| Co-Processors/DSP | Multimedia; NEON™ SIMD |
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection |
| Display & Interface Controllers | Keypad, LCD |
| RoHS Status | ROHS3 Compliant |
MCIMX6L2EVN10ACR Overview
With a packing size of 432-TFBGA, this embedded microprocessor is ideal for international shipping. High reliability can be achieved by using the advanced packaging method Tape & Reel (TR). CPUs have 1 Core 32-Bit cores/bus width. Recognize operating temperatures around -40°C~105°C TA. This is part of the i.MX6SL series. The CPU is cored by a processor with a number of 0 cores. LPDDR2, LVDDR3, DDR3 RAM controllers are used by this CPU. Featuring AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART interfaces, this microprocessor can better serve you. As far as I/O is concerned, this CPU runs at 1.2V 1.8V 3.0V.
MCIMX6L2EVN10ACR Features
ARM? Cortex?-A9 Core
MCIMX6L2EVN10ACR Applications
There are a lot of NXP USA Inc. MCIMX6L2EVN10ACR Microprocessor applications.
- Mobile computers
- Refrigerators
- Instrumentation and process control field
- Day to day life field
- DDC control
- 3D printers
- Measuring revolving objects
- Keyboards
- Dishwashers
- Guidance-GPS