M2S050T-1FCS325
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.Package 325-TFBGA, CSPBGA is assigned to this system on a chip by the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.SmartFusion?2 is the series in which this system on chip SoC falls under.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.This SoC security combines FPGA - 50K Logic Modules and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part is comprised of 200 inputs and outputs.It is advised to utilize a 1.2V power supply.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.At least 1.14V can be supplied as a power source.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.Having 325 terminations in total makes system on a chip possible.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.In order for this SoC chip to work properly, you can have 200 outputs.There is 1.2V power supply required for system on chip.200 inputs are available on the SoC chip.System on chips of logic are comprised of 56340 logic cells.The flash size of the SoC meaning is 256KB.Moreover, this SoC processor also includes LG-MIN, WD-MIN as its additional features.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050T-1FCS325 System On Chip (SoC) applications.
- External USB hard disk/SSD
- Transmitters
- Print Special Issue Flyer
- Communication network-on-Chip (cNoC)
- Central alarm system
- Measurement testers
- Servo drive control module
- Self-aware system-on-chip (SoC)
- Networked Media Encode/Decode
- Temperature Sensors