M2S025T-VF400I

M2S025T-VF400I

400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S025T-VF400I
  • Package: 400-LFBGA
  • Datasheet: PDF
  • Stock: 980
  • Description: 400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 207 I/O1.2V (Kg)

Details

Tags

Parameters
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B400
Number of Outputs 207
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 207
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 207
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 25K Logic Modules
Number of Logic Cells 27696
Flash Size 256KB
Height Seated (Max) 1.51mm
Length 17mm
Width 17mm
RoHS Status Non-RoHS Compliant

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.Tray package houses this SoC system on a chip.This SoC part has a total of 207 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 400 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 207 outputs.There is 1.2V power supply required for system on chip.There are 207 inputs available on the SoC chip.27696 logic cells are present in logic system on chips.There is a flash of 256KB on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S025T-VF400I System On Chip (SoC) applications.

  • Samsung galaxy gear
  • Communication network-on-Chip (cNoC)
  • System-on-chip (SoC)
  • String inverter
  • Industrial robot
  • Functional safety for critical applications in the automotive
  • ARM Cortex M4 microcontroller
  • Deep learning hardware
  • Automotive
  • PC peripherals

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