Parameters |
Factory Lead Time |
10 Weeks |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
400-LFBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
400 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
0.8mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B400 |
Number of Outputs |
207 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
207 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
207 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 25K Logic Modules |
Number of Logic Cells |
27696 |
Flash Size |
256KB |
Height Seated (Max) |
1.51mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the SmartFusion?2 series.The average operating temps for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.Tray package houses this SoC system on a chip.This SoC part has a total of 207 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 400 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.A SoC chip like this can have 207 outputs.There is 1.2V power supply required for system on chip.There are 207 inputs available on the SoC chip.27696 logic cells are present in logic system on chips.There is a flash of 256KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S025T-VF400I System On Chip (SoC) applications.
- Samsung galaxy gear
- Communication network-on-Chip (cNoC)
- System-on-chip (SoC)
- String inverter
- Industrial robot
- Functional safety for critical applications in the automotive
- ARM Cortex M4 microcontroller
- Deep learning hardware
- Automotive
- PC peripherals