M2S010-VFG256I

M2S010-VFG256I

256 Terminations-40°C~100°C TJ 256 Pin System On ChipSmartFusion?2 Series 138 I/O1.2V Min 1.14V VMax 1.26V V


  • Manufacturer: Microsemi Corporation
  • Origchip NO: 523-M2S010-VFG256I
  • Package: 256-LFBGA
  • Datasheet: PDF
  • Stock: 481
  • Description: 256 Terminations-40°C~100°C TJ 256 Pin System On ChipSmartFusion?2 Series 138 I/O1.2V Min 1.14V VMax 1.26V V(Kg)

Details

Tags

Parameters
Factory Lead Time 8 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Package / Case 256-LFBGA
Number of Pins 256
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish MATTE TIN
Additional Feature LG-MIN, WD-MIN
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 138
Qualification Status Not Qualified
Power Supplies 1.2V
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
Number of I/O 138
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 10K Logic Modules
Number of Logic Cells 12084
Flash Size 256KB
Height Seated (Max) 1.56mm
Length 14mm
Width 14mm
RoHS Status RoHS Compliant
Lead Free Lead Free

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is used to build this SoC.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.It is expected that this SoC meaning will operate at -40°C~100°C TJ on average.A key point to note is that this SoC security combines FPGA - 10K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.As a whole, this SoC part includes 138 I/Os.A 1.2V power supply is recommended.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.As a result, there are 256 terminations in total, which does really benefit system on a chip.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.This SoC chip is capable of having 138 outputs, which is convenient.This system on chip SoC requires 1.2V power supply at all.Logic system on chips consist of 12084 logic cells.As for its flash size, it is 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.The computer SoC has a pin count of 256.This power supply is rated with a maximum voltage of 1.26V.Power is provided to it at least to the extent that 1.14V is required.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S010-VFG256I System On Chip (SoC) applications.

  • Measurement testers
  • Apple smart watch
  • Central alarm system
  • Published Paper
  • DC-input BLDC motor drive
  • Temperature Sensors
  • Efficient hardware for inference of neural networks
  • Functional safety for critical applications in the automotive
  • ARM
  • Efficient hardware for training of neural networks

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