M2S010-FGG484I
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 484-BGA |
| Surface Mount | YES |
| Number of Pins | 484 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2014 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 484 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of Outputs | 233 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Supply Voltage-Max (Vsup) | 1.26V |
| Memory Size | 256kB |
| Number of I/O | 233 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Data Rate | 667 Mbps |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 12084 |
| Max Frequency | 400MHz |
| Number of Logic Blocks (LABs) | 1007 |
| Primary Attributes | FPGA - 10K Logic Modules |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 23mm |
| Width | 23mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 10K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 233 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.There are 484 terminations in total and that really benefits system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 233 outputs.There is a flash of 256KB.The computer SoC has a pin count of 484.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010-FGG484I System On Chip (SoC) applications.
- Automotive gateway
- Functional safety for critical applications in the industrial sectors
- Microcontroller
- sequence controllers
- DC-input BLDC motor drive
- ARM processors
- Robotics
- Body control module
- Communication interfaces ( I2C, SPI )
- Apple smart watch