| Parameters |
| Factory Lead Time |
8 Weeks |
| Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type |
Surface Mount |
| Package / Case |
QFN |
| Surface Mount |
YES |
| Supplier Device Package |
40-QFN |
| Packaging |
Tape & Reel (TR) |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
40 |
| Voltage - Supply |
3.3V |
| Terminal Position |
QUAD |
| Terminal Form |
NO LEAD |
| Supply Voltage |
3.3V |
| Terminal Pitch |
0.5mm |
| JESD-30 Code |
S-XQCC-N40 |
| Function |
Subscriber Line Interface Concept (SLIC) |
| Operating Temperature (Max) |
85°C |
| Operating Temperature (Min) |
-40°C |
| Temperature Grade |
INDUSTRIAL |
| Interface |
Serial |
| Number of Circuits |
2 |
| Height Seated (Max) |
1mm |
| Length |
6mm |
| Width |
6mm |
| RoHS Status |
ROHS3 Compliant |
LE9540DUQCT Overview
A QFN package is used to reduce board space requirements.A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted with type Surface Mount.A 2-circuit composes this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Configuration of the telecom circuit shows 40 terminations.With 3.3V as the supply voltage, it operates.85°C is the maximum operating temperature telecommunications equipment supports.There is a minimum operating temperature of -40°C supported by telecommunications equipment.
LE9540DUQCT Features
Available in the QFN package
LE9540DUQCT Applications
There are a lot of Microchip Technology LE9540DUQCT Telecom applications.
- Digital Modems
- PBXs channel bank
- T1/E1/J1 add/drop multiplexers (MUX)
- Multi-Line E1 Interface Cards
- Wireless base stations
- Channel Banks
- Set-Top Box
- Fiber Optic Terminals
- Digital subscriber line access multiplexer (DSLAM)
- Integrated Access Devices (IADs)