HMC859LC3
| Parameters | |
|---|---|
| Factory Lead Time | 8 Weeks |
| Lifecycle Status | PRODUCTION (Last Updated: 4 weeks ago) |
| Contact Plating | Gold |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 16-LFCQFN Exposed Pad |
| Number of Pins | 16 |
| Weight | 288.002805mg |
| Packaging | Strip |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 16 |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Terminal Position | QUAD |
| Terminal Form | NO LEAD |
| Peak Reflow Temperature (Cel) | 260 |
| Terminal Pitch | 0.5mm |
| Frequency | 0Hz~26GHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | HMC859 |
| Function | Divide-by-8 |
| Output Voltage | -15mV |
| Operating Supply Voltage | -3.3V |
| Temperature Grade | INDUSTRIAL |
| Max Supply Voltage | -3V |
| Min Supply Voltage | -3.6V |
| Operating Supply Current | 97mA |
| Family | 859 |
| Logic IC Type | LOGIC CIRCUIT |
| RF Type | General Purpose |
| Secondary Attributes | With Reset |
| Height Seated (Max) | 1.31mm |
| Length | 3mm |
| Width | 3mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
See Relate Datesheet