| Parameters |
| Mounting Type |
Surface Mount |
| Package / Case |
100-LQFP |
| Surface Mount |
YES |
| Operating Temperature |
-40°C~85°C |
| Packaging |
Tray |
| Published |
2004 |
| JESD-609 Code |
e0 |
| Pbfree Code |
no |
| Part Status |
Obsolete |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Number of Terminations |
100 |
| ECCN Code |
EAR99 |
| Terminal Finish |
Tin/Lead (Sn/Pb) |
| Subcategory |
Other Telecom ICs |
| Technology |
CMOS |
| Voltage - Supply |
3.14V~3.47V |
| Terminal Position |
QUAD |
| Terminal Form |
GULL WING |
| Peak Reflow Temperature (Cel) |
240 |
| Supply Voltage |
3.3V |
| Terminal Pitch |
0.5mm |
| Reach Compliance Code |
not_compliant |
| Time@Peak Reflow Temperature-Max (s) |
20 |
| Base Part Number |
DS21Q50 |
| JESD-30 Code |
S-PQFP-G100 |
| Function |
Transceiver |
| Qualification Status |
Not Qualified |
| Power Supplies |
3.3V |
| Interface |
E1 |
| Number of Circuits |
4 |
| Current - Supply |
230mA |
| Carrier Type |
CEPT PCM-30/E-1 |
| Height Seated (Max) |
1.6mm |
| RoHS Status |
Non-RoHS Compliant |
| Lead Free |
Contains Lead |
DS21Q50LN Overview
100-LQFP package is used to save board space.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.A 4-circuit composes this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.14V~3.47V can be operated more efficiently.-40°C~85°C is the operating temperature that can be set for reliable performance.There are 100 terminations can be found in telecom switching configuration.It operates with a voltage of 3.3V.Telecom switching's base part number, DS21Q50, can be used to find related parts.The current supply is 230mA.Other Telecom ICs is a subcategory of telecommunications device .
DS21Q50LN Features
Available in the 100-LQFP package
DS21Q50LN Applications
There are a lot of Maxim Integrated DS21Q50LN Telecom applications.
- Multi-Line E1 Interface Cards
- DECT (Digital European Cordless Telephone) Base Stations
- High-Density T1/E1/J1 interfaces for Multiplexers
- Integrated Multi-Service Access Platforms (IMAPs)
- Digital Modems
- Add/Drop multiplexers (ADMs)
- Routers
- Integrated Access Devices
- SONET/SDH terminal
- CSU/DSU E1/T1/J1 Interface