| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 300-BBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 2002 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 300 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Telecom ICs |
| Technology | CMOS |
| Voltage - Supply | 2.97V~3.63V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | DS21FF42 |
| Pin Count | 300 |
| JESD-30 Code | S-PBGA-B300 |
| Qualification Status | Not Qualified |
| Power Supplies | 3.3V |
| Interface | Parallel/Serial |
| Current - Supply | 300mA |
| Telecom IC Type | FRAMER |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |