DS2155G+
| Parameters | |
|---|---|
| Factory Lead Time | 6 Weeks |
| Surface Mount | YES |
| Packaging | Tray |
| Published | 2006 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 100 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other Telecom ICs |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 0.8mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 100 |
| JESD-30 Code | S-PBGA-B100 |
| Qualification Status | Not Qualified |
| Operating Temperature (Max) | 70°C |
| Power Supplies | 3.3V |
| Temperature Grade | COMMERCIAL |
| Telecom IC Type | FRAMER |
| Carrier Type | CEPT PCM-30/E-1 |
| Length | 10mm |
| Width | 10mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
See Relate Datesheet