DS21455
| Parameters | |
|---|---|
| Factory Lead Time | 23 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~70°C |
| Packaging | Tray |
| Published | 2003 |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Subcategory | Other Telecom ICs |
| Technology | BIPOLAR |
| Voltage - Supply | 3.135V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1.27mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | DS21455 |
| JESD-30 Code | S-PBGA-B256 |
| Function | Line Interface Unit (LIU) |
| Qualification Status | Not Qualified |
| Power Supplies | 3.3V |
| Interface | LIU |
| Number of Circuits | 4 |
| Telecom IC Type | FRAMER |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet