| Parameters | |
|---|---|
| Contact Plating | Gold |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | SIP |
| Number of Pins | 8 |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| Number of Positions or Pins (Grid) | 8 (1 x 8) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Brass |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2010 |
| Series | D01-950 |
| Feature | Elevated |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | SIP |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 1A |
| Current Rating | 1A |
| Pitch - Mating | 0.100 2.54mm |
| Contact Finish - Post | Tin |
| Lead Length | 3.2004mm |
| Contact Resistance | 10mOhm |
| Termination Post Length | 0.126 3.20mm |
| Pitch - Post | 0.100 2.54mm |
| Contact Finish Thickness - Mating | 29.5μin 0.75μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Flammability Rating | UL94 V-0 |