BDN09-3CB
| Parameters | |
|---|---|
| Factory Lead Time | 17 Weeks |
| Material | Aluminum |
| Shape | Square, Pin Fins |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Material Finish | Black Anodized |
| Published | 2017 |
| Series | BDN |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Top Mount |
| Construction | EXTRUDED |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Height Off Base (Height of Fin) | 0.355 9.02mm |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 400 LFM |
| Thermal Resistance @ Natural | 26.90°C/W |
| Profile | PIN FIN ARRAY |
| Fin Orientation | OMNIDIRECT |
| Device Used On | IC |
| Length | 0.910 23.11mm |
| Width | 0.910 23.11mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet