| Parameters | |
|---|---|
| Factory Lead Time | 18 Weeks |
| Package / Case | Nonstandard Chip |
| Operating Temperature | -55°C~150°C |
| Packaging | Tray |
| Series | UWSC |
| Size / Dimension | 0.015Lx0.015W 0.38mmx0.38mm |
| Tolerance | ±15% |
| Feature | High Reliability, Low Profile |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | High Stability, Vertical Silicon Cap, Wirebond |
| Capacitance | 150pF |
| ESR (Equivalent Series Resistance) | 14mOhm |
| Voltage - Breakdown | 150V |
| ESL (Equivalent Series Inductance) | 6pH |
| Height | 0.005 0.12mm |
| RoHS Status | ROHS3 Compliant |