| Parameters | |
|---|---|
| Factory Lead Time | 18 Weeks |
| Package / Case | Nonstandard Chip |
| Operating Temperature | -55°C~150°C |
| Packaging | Tray |
| Series | WLSC |
| Size / Dimension | 0.012Lx0.012W 0.29mmx0.29mm |
| Tolerance | ±15% |
| Feature | High Reliability, Low Profile |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Applications | High Stability, Vertical Silicon Cap, Wirebond |
| Capacitance | 1nF |
| ESR (Equivalent Series Resistance) | 50mOhm |
| Voltage - Breakdown | 50V |
| ESL (Equivalent Series Inductance) | 50pH |
| Height | 0.005 0.12mm |
| RoHS Status | ROHS3 Compliant |