89HPES16T4AG2ALGI8
| Parameters | |
|---|---|
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Package / Case | FCBGA |
| Number of Pins | 324 |
| Packaging | Tape & Reel (TR) |
| Published | 1999 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 |
| Number of Terminations | 324 |
| ECCN Code | EAR99 |
| Terminal Finish | TIN SILVER COPPER |
| HTS Code | 8542.39.00.01 |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Pin Count | 324 |
| Operating Temperature (Max) | 85°C |
| Operating Temperature (Min) | -40°C |
| Supply Voltage-Max (Vsup) | 1.1V |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Min (Vsup) | 0.9V |
| Interface | PCI Express |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Clock Frequency | 100MHz |
| Bus Compatibility | PCI |
| Height Seated (Max) | 3.42mm |
| Length | 19mm |
| Width | 19mm |
| Thickness | 3.27mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
See Relate Datesheet