8080-1G24
| Parameters | |
|---|---|
| Factory Lead Time | 11 Weeks |
| Mounting Type | Chassis Mount |
| Housing Material | Diallyl Phthalate (DAP) |
| Number of Positions or Pins (Grid) | 3 (Round) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2011 |
| Feature | Closed Frame |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| Type | Transistor, TO-3 |
| Contact Finish - Mating | Tin-Lead |
| Contact Resistance | 25mOhm |
| Contact Finish Thickness - Mating | 20.0μin 0.51μm |
| Contact Finish Thickness - Post | 20.0μin 0.51μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet