| Parameters |
| Factory Lead Time |
12 Weeks |
| Mounting Type |
Surface Mount |
| Package / Case |
144-BGA |
| Operating Temperature |
0°C~70°C |
| Packaging |
Tray |
| Series |
72V |
| Part Status |
Active |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| Voltage - Supply |
3.15V~3.45V |
| Base Part Number |
72V3680 |
| Function |
Synchronous |
| Current - Supply (Max) |
40mA |
| Memory Size |
576K 16K x 36 |
| Access Time |
4ns |
| Data Rate |
166MHz |
| Bus Directional |
Uni-Directional |
| FWFT Support |
Yes |
| Expansion Type |
Depth, Width |
| RoHS Status |
Non-RoHS Compliant |
72V3680L6BB Overview
144-BGA is the package in which FIFO memory chip is contained.In the shape of a Tray , it's packaged.Apps and data can be stored in the 576K 16K x 36 memory of the FIFO chip.It is recommended that the temperature be kept at 0°C~70°C to ensure reliable operation.There is a mounting type of Surface Mount on the FIFO memory.Powered by a voltage of 3.15V~3.45V , it operates on a low supply voltage.A component in the 72V series, this is an memory logic.As far as operating current is concerned, it has a maximum of 40mA .A member of the 72V3680 family, it has the following characteristics.
72V3680L6BB Features
576K 16K x 36 memory size
72V series
Best part number of 72V3680
72V3680L6BB Applications
There are a lot of Renesas Electronics America Inc. 72V3680L6BB FIFOs Memory applications.
- Event Recorder
- Computers
- Thermal Management for DDR3 Memory Modules
- Firmware loaders
- High-speed disk
- Network bridges
- Data communications
- Switches
- Network switching/routing
- Code converters