72V275L15PFGI
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 64-LQFP |
| Supplier Device Package | 64-TQFP (14x14) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | 72V |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3V~3.6V |
| Base Part Number | 72V275 |
| Function | Synchronous |
| Current - Supply (Max) | 60mA |
| Memory Size | 576K 32K x 18 |
| Access Time | 10ns |
| Data Rate | 66.7MHz |
| Bus Directional | Uni-Directional |
| Retransmit Capability | Yes |
| FWFT Support | Yes |
| Programmable Flags Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72V275L15PFGI Overview
The 64-LQFP package contains FIFO memory chip.This FIFO memory chip is packaged as a Tray .A memory of 576K 32K x 18 is available for storing applications and data on this FIFO chip.A temperature regulation of -40°C~85°C is crucial for reliable operation.There is Surface Mount mounting type for this FIFO memory.For operation, a voltage of 3V~3.6V is used.The 72V series contains this memory logic.There is a FIFO's maximum operating supply current of 60mA .A member of the 72V275 family, it has the following characteristics.
72V275L15PFGI Features
576K 32K x 18 memory size
72V series
Best part number of 72V275
72V275L15PFGI Applications
There are a lot of Renesas Electronics America Inc. 72V275L15PFGI FIFOs Memory applications.
- General Data Collection Applications at Extreme High-Temperatures
- Down-Hole Energy Drilling
- Thermal Management for DDR3 Memory Modules
- Temporary storage elements
- Magnetic memories
- TVs
- SPI Bus Flash Memory Device
- A/D output buffers
- Event Recorder
- PC peripheral