72T36125L5BBI
| Parameters | |
|---|---|
| Factory Lead Time | 12 Weeks |
| Mounting Type | Surface Mount |
| Package / Case | 240-BGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Series | 72T |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 2.375V~2.625V |
| Base Part Number | 72T36125 |
| Function | Asynchronous, Synchronous |
| Current - Supply (Max) | 90mA |
| Memory Size | 9M 256K x 36 |
| Access Time | 10ns, 3.6ns |
| Data Rate | 83MHz, 200MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | Yes |
| Expansion Type | Depth, Width |
| RoHS Status | Non-RoHS Compliant |
72T36125L5BBI Overview
You can find FIFO memory chip in the 240-BGA package.In this case, it is packaged in case number Tray .A memory of 9M 256K x 36 is available for storing applications and data on this FIFO chip.Reliable operation requires a temperature of -40°C~85°C .Mounting type Surface Mount is assigned to the FIFO memory.To operate, the FIFO products requires a voltage supply of 2.375V~2.625V .It belongs to the 72T series of memory logics.There is a maximum operating current of 90mA in memory IC's supply.This object belongs to the family 72T36125 .
72T36125L5BBI Features
9M 256K x 36 memory size
72T series
Best part number of 72T36125
72T36125L5BBI Applications
There are a lot of Renesas Electronics America Inc. 72T36125L5BBI FIFOs Memory applications.
- Controlled baseline
- Notebook
- Firmware loaders
- Medical Monitoring Device
- Temporary storage elements
- Disk Controllers
- SPI Bus Flash Memory Device
- General Data Collection Applications at Low-Temperatures
- Test site
- Thermal Management for DDR3 Memory Modules