72230L10TPG
| Parameters | |
|---|---|
| Factory Lead Time | 13 Weeks |
| Mounting Type | Through Hole |
| Package / Case | 28-DIP (0.300, 7.62mm) |
| Operating Temperature | 0°C~70°C |
| Packaging | Tube |
| Series | 7200 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 4.5V~5.5V |
| Function | Synchronous |
| Current - Supply (Max) | 40mA |
| Memory Size | 16K 2K x 8 |
| Access Time | 6.5ns |
| Data Rate | 100MHz |
| Bus Directional | Uni-Directional |
| FWFT Support | No |
| Expansion Type | Depth, Width |
| RoHS Status | ROHS3 Compliant |
72230L10TPG Overview
The 28-DIP (0.300, 7.62mm) package contains FIFO memory chip.In terms of packaging, it comes in Tube cases.There is a memory of 16K 2K x 8 on the FIFO chip that can be used to store applications and data.The temperature should be kept at 0°C~70°C to ensure reliable operation.The FIFO memory's mounting type is Through Hole .To operate, the FIFO products requires a voltage supply of 4.5V~5.5V .This memory logic is part of the 7200 series.There is a FIFO's maximum operating supply current of 40mA .
72230L10TPG Features
16K 2K x 8 memory size
7200 series
72230L10TPG Applications
There are a lot of Renesas Electronics America Inc. 72230L10TPG FIFOs Memory applications.
- Thermal Management for DDR3 Memory Modules
- HDD
- Portable Information Devices
- Desktop Computers
- SPD for DDR3 Memory Modules
- Temporary storage elements
- Industrial Systems
- Emulators
- SPI Bus Flash Memory Device
- Tape controllers