67SLG100100100PI00
| Parameters | |
|---|---|
| Factory Lead Time | 4 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.394 10.00mm |
| Length | 0.394 10.00mm |
| Width | 0.394 10.00mm |
| Thickness | 10.0076mm |
| RoHS Status | RoHS Compliant |
67SLG100100100PI00 Overview
The Contact RFI contains materials from Polyurethane Foam, Tin-Copper Polyester (SN/CU).It is possible for the EMI/RFI to operate at a temperature of -40°C~70°C.High reliability is achieved by using advanced RFI and EMI contact' packagings Tape & Reel (TR).At a temperature around 158°C degrees Celsius, contacter RFI should be running.Film Over Foam contacter RFI type.A RFI EMI from the well-known SMD Grounding Metallized series of products is being offered here.
67SLG100100100PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG100100100PI00 Applications
There are a lot of Laird Technologies EMI 67SLG100100100PI00 RFI and EMI Contacts applications.
- LED Lighting
- Fitness
- Smart Meters
- Thermostats
- Secure Payment
- Receive
- Health care
- Health and Fitness
- Transmit