67SLG040040025PI00
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Shape | Rectangle |
| Operating Temperature | -40°C~70°C |
| Packaging | Tape & Reel (TR) |
| Published | 2015 |
| Series | SMD Grounding Metallized |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Type | Film Over Foam |
| Max Operating Temperature | 158°C |
| Min Operating Temperature | -40°C |
| Attachment Method | Solder |
| Height | 0.157 4.00mm |
| Length | 0.098 2.50mm |
| Width | 0.157 4.00mm |
| Thickness | 3.9878mm |
| RoHS Status | RoHS Compliant |
67SLG040040025PI00 Overview
The Contact RFI is packaged with the materials of Polyurethane Foam, Tin-Copper Polyester (SN/CU).It is possible for the EMI/RFI to operate at a temperature of -40°C~70°C.Advanced RFI and EMI contact' packaging Tape & Reel (TR) is used to provide high reliability.At158°C, contacter RFI should run.Input type Film Over Foam of the contacter RFI.The RFI EMI that you are looking at comes from our well-known SMD Grounding Metallized series product line.
67SLG040040025PI00 Features
Film Over Foam
Tape & Reel (TR) is used
SMD Grounding Metallized series
67SLG040040025PI00 Applications
There are a lot of Laird Technologies EMI 67SLG040040025PI00 RFI and EMI Contacts applications.
- Low Noise Amplifier
- Health and Fitness
- Home and Security
- Thermostats
- Secure Payment
- Transmit
- Smart Energy
- Fitness
- LoT applications
- Power management