44-647-10
| Parameters | |
|---|---|
| Lead Free | Contains Lead |
| Factory Lead Time | 5 Weeks |
| Mounting Type | Through Hole |
| Number of Pins | 44 |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Phosphor Bronze |
| Packaging | Bulk |
| Published | 2002 |
| Series | 647 |
| JESD-609 Code | e4 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Additional Feature | UL 94V-0 |
| Contact Finish - Mating | Gold |
| Current Rating (Amps) | 3A |
| Number of Contacts | 44 |
| Contact Finish - Post | Tin |
| Device Socket Type | IC SOCKET |
| Termination Post Length | 0.180 4.57mm |
| Convert From (Adapter End) | SOIC |
| Convert To (Adapter End) | DIP, 0.6 (15.24mm) Row Spacing |
| Height | 2.39mm |
| Length | 69.9mm |
| Contact Finish Thickness - Mating | 10.0μin 0.25μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| RoHS Status | Non-RoHS Compliant |
See Relate Datesheet