3M869XW LPSA DISC 1.865X.102
| Parameters | |
|---|---|
| Factory Lead Time | 3 Weeks |
| Abrasive Material | Silicon Dioxide |
| Series | 869XW |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Type | Lapping Film |
| Applications | Fiber Optic Connector Polishing |
| Diameter | 1.87 47.49mm |
| RoHS Status | RoHS Compliant |
See Relate Datesheet