| Parameters | |
|---|---|
| Contact Material | Beryllium Copper |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Contact Shape | Circular |
| Insulation Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Housing Material | PLASTIC |
| Operating Temperature | -55°C~125°C |
| Packaging | Bulk |
| Published | 2007 |
| Series | 316 |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Termination | Solder |
| ECCN Code | EAR99 |
| Connector Type | Elevated Socket |
| Number of Positions | 1 |
| Additional Feature | SIP |
| HTS Code | 8536.90.40.00 |
| Fastening Type | Push-Pull |
| Contact Finish - Mating | Gold |
| Contact Type | Female Socket |
| Current Rating (Amps) | 3A |
| Insulation Height | 0.315 8.00mm |
| Style | Board to Board |
| Number of Positions Loaded | All |
| Insulation Color | Black |
| Contact Length - Post | 0.118 3.00mm |
| Number of Contacts | 1 |
| Contact Finish - Post | Tin |
| Device Socket Type | IC SOCKET |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm |
| Contact Finish Thickness - Post | 200.0μin 5.08μm |
| Material Flammability Rating | UL94 V-0 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |