2350616-1

2350616-1

DUAL LGA,250 POS, DMD SOCKET


Details

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Parameters
Mounting Type Surface Mount
Housing Material Thermoplastic
Number of Positions or Pins (Grid) 250 (16 x 25)
Contact Material - Mating Copper Alloy
Operating Temperature -25°C~100°C
Feature Board Guide, Open Frame
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Type LGA
Contact Finish - Mating Gold
Current Rating (Amps) 500mA
Pitch - Mating 0.039 1.00mm
Contact Finish Thickness - Mating 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
See Relate Datesheet

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